Clip Interconnect Design Feature – Detecting Excess Solder for Clipbonded Package
Ramil A. Atienza proposed a side-notch clip design so excess solder can be spotted by visual inspection.
Condition BEFORE Innovation
Current SOT1205 Clip Design Any excessive solders are not easily accessible from the naked eye Concern has been raised due to product failure discovered in customer's application brought by excessive solder dispensed on top of the die for SOT1205.
Change/Intervention Done
Proposed new SOT1205 Clip Design Side notch for excess solder attach, once solder formed in this region, it can easily notice by operator without putting inside x-ray machine.
Condition AFTER Innovation
This invention is detectable through visual inspection and cross section. Related patent known to the Inventor US4756696A - Customer and Market > All Nexperia external customer for package that uses clips as interconnects.
From Balita Issue 3917
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